Nokia 5030 UEM Reballing procedures and techniques.
1. remove the hot sink covering shield.
Picture1
2. apply adequate soldering paste to the UEM'S surrounding.
Picture 2
3. Apply heat and remove in upward direction when the solder balls already melted.
Picture 3
4. Once remove clean the UEM call bumps.
Picture 4
5. Do apply and reball the UEM
Picture 5
6. Once reballing the UEM has been made. replace the UEM according to its pattern on the PCB Board.
Picture 6
7. put the covering shield back.
Picture 7
8. Flash the Phone, write RPL and Rebuild IMEI
1. remove the hot sink covering shield.
Picture1
2. apply adequate soldering paste to the UEM'S surrounding.
Picture 2
3. Apply heat and remove in upward direction when the solder balls already melted.
Picture 3
4. Once remove clean the UEM call bumps.
Picture 4
5. Do apply and reball the UEM
Picture 5
6. Once reballing the UEM has been made. replace the UEM according to its pattern on the PCB Board.
Picture 6
7. put the covering shield back.
Picture 7
8. Flash the Phone, write RPL and Rebuild IMEI
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