Nokia 5030 UEM Reballing procedures and techniques.
1. remove the hot sink covering shield.
Picture1
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2. apply adequate soldering paste to the UEM'S surrounding.
Picture 2
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3. Apply heat and remove in upward direction when the solder balls already melted.
Picture 3
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4. Once remove clean the UEM call bumps.
Picture 4
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5. Do apply and reball the UEM
Picture 5
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6. Once reballing the UEM has been made. replace the UEM according to its pattern on the PCB Board.
Picture 6
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7. put the covering shield back.
Picture 7
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8. Flash the Phone, write RPL and Rebuild IMEI
1. remove the hot sink covering shield.
Picture1
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2. apply adequate soldering paste to the UEM'S surrounding.
Picture 2
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3. Apply heat and remove in upward direction when the solder balls already melted.
Picture 3
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4. Once remove clean the UEM call bumps.
Picture 4
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5. Do apply and reball the UEM
Picture 5
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6. Once reballing the UEM has been made. replace the UEM according to its pattern on the PCB Board.
Picture 6
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7. put the covering shield back.
Picture 7
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8. Flash the Phone, write RPL and Rebuild IMEI
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